| 发明名称 |
Packaged semiconductor device |
| 摘要 |
A packaged semiconductor device includes a lead frame having a plurality of leads; a semiconductor die mounted onto the lead frame; and an encapsulant surrounding the semiconductor die. At least a portion of each of the leads is surrounded by the encapsulant, wherein, each lead includes a thin portion external to the encapsulant and a thick portion that is surrounded by the encapsulant, wherein the thin portion is thinner than the thick portion. |
| 申请公布号 |
US9287200(B2) |
申请公布日期 |
2016.03.15 |
| 申请号 |
US201313928876 |
申请日期 |
2013.06.27 |
| 申请人 |
Freescale Semiconductor, Inc. |
发明人 |
Higgins, III Leo M. |
| 分类号 |
H01L23/495;H01L23/28;H01L21/56;H01L23/00;H01L21/48 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A packaged semiconductor device, comprising:
a lead frame having a plurality of leads; a semiconductor die mounted onto the lead frame; an encapsulant surrounding the semiconductor die, wherein at least a portion of each of the leads is surrounded by the encapsulant, wherein, each lead comprises a knee region of the lead extending external to the encapsulant that is a thin portion and a first thick portion that is surrounded partially by and extends external to the encapsulant and a second thick portion that is a foot portion of the lead, wherein the thin portion is thinner than the first and second thick portions and the thin portion is between the first and second thick portions; and a bend in a heel/ankle region of the second thick portion adjacent to the foot portion. |
| 地址 |
Austin TX US |
