发明名称 |
Pre-patterned hard mask for ultrafast lithographic imaging |
摘要 |
A method of fabricating a substrate including coating a first resist onto a hardmask, exposing regions of the first resist to electromagnetic radiation at a dose of 10.0 mJ/cm2 or greater and removing a portion of said the and forming guiding features. The method also includes etching the hardmask to form isolating features in the hardmask, applying a second resist within the isolating features forming regions of the second resist in the hardmask, and exposing regions of the second resist to electromagnetic radiation having a dose of less than 10.0 mJ/cm2 and forming elements. |
申请公布号 |
US9285682(B2) |
申请公布日期 |
2016.03.15 |
申请号 |
US201514642328 |
申请日期 |
2015.03.09 |
申请人 |
Intel Corporation |
发明人 |
Bristol Robert L.;Nyhus Paul A.;Wallace Charles H. |
分类号 |
G03F7/095;G03F7/00;G03F7/20;G03F7/004;G03F7/09;G03F7/38;H01L21/027;H01L21/033 |
主分类号 |
G03F7/095 |
代理机构 |
Grossman, Tucker, Perreault & Pfleger, PLLC |
代理人 |
Grossman, Tucker, Perreault & Pfleger, PLLC |
主权项 |
1. An intermediate for use in a method of fabricating a substrate, comprising:
a substrate; a hardmask layer on said substrate; and a cross grating formed on said hardmask layer, said cross grating comprising a first patterned layer and a second patterned layer; wherein:
said first patterned layer is present on said hardmask layer;said second patterned layer is on said first patterned layer; andsaid first and second patterned layers intersect to form regions in which least a portion of said hardmask layer is exposed. |
地址 |
Santa Clara CA US |