发明名称 Pre-patterned hard mask for ultrafast lithographic imaging
摘要 A method of fabricating a substrate including coating a first resist onto a hardmask, exposing regions of the first resist to electromagnetic radiation at a dose of 10.0 mJ/cm2 or greater and removing a portion of said the and forming guiding features. The method also includes etching the hardmask to form isolating features in the hardmask, applying a second resist within the isolating features forming regions of the second resist in the hardmask, and exposing regions of the second resist to electromagnetic radiation having a dose of less than 10.0 mJ/cm2 and forming elements.
申请公布号 US9285682(B2) 申请公布日期 2016.03.15
申请号 US201514642328 申请日期 2015.03.09
申请人 Intel Corporation 发明人 Bristol Robert L.;Nyhus Paul A.;Wallace Charles H.
分类号 G03F7/095;G03F7/00;G03F7/20;G03F7/004;G03F7/09;G03F7/38;H01L21/027;H01L21/033 主分类号 G03F7/095
代理机构 Grossman, Tucker, Perreault & Pfleger, PLLC 代理人 Grossman, Tucker, Perreault & Pfleger, PLLC
主权项 1. An intermediate for use in a method of fabricating a substrate, comprising: a substrate; a hardmask layer on said substrate; and a cross grating formed on said hardmask layer, said cross grating comprising a first patterned layer and a second patterned layer; wherein: said first patterned layer is present on said hardmask layer;said second patterned layer is on said first patterned layer; andsaid first and second patterned layers intersect to form regions in which least a portion of said hardmask layer is exposed.
地址 Santa Clara CA US