SOCKET FOR TESTING SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

A socket for testing a semiconductor package is disclosed. The socket for testing a semiconductor package comprises: an upper plate having a plurality of first holes vertically penetrated; a lower plate having a plurality of second holes vertically penetrated, and having a depression formed on an upper surface; and a probe inserted into the first hole and the second hole. The upper plate is inserted into and combined with the depression of the lower plate. The probe comprises: a contact member connected to the semiconductor package; an elastic member connected to the contact member, and of which at least part is exposed to the outside; and a connection member connected to the elastic member and a printed circuit board.