DIE ATTACHMENT APPARATUS AND METHOD UTILIZING ACTIVATED FORMING GAS

摘要

A die attachment apapratus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment statin introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.