发明名称 POLISHING APPARATUS
摘要 The present invention provides a polishing apparatus for determining an end point of polishing accurately. The polishing apparatus of the present invention includes: a polishing table (12); a first electric motor (14) for rotating the polishing table; a top ring (20) capable of maintaining a workpiece together with the polishing table; and a second electric motor (22) for rotating the top ring. The polishing apparatus can planarize a surface of the workpiece by polishing the workpiece in a state of being pinched with the polishing table by the top ring, by rotating the top ring by the second electric motor and also by rotation the polishing table by the first electric motor. At least one from the first and the second electric motor includes a winding of plural phases, and includes a weighting part for weighting a difference to a current ratio of each phase, and a detection part for detecting torque variation of the electric motor, which has occurred by the polishing, by detecting variation in the current of a phase which is weighted highly by the weighting part.
申请公布号 KR20160028434(A) 申请公布日期 2016.03.11
申请号 KR20160023436 申请日期 2016.02.26
申请人 EBARA CORPORATION 发明人 SHINOZAKI HIROYUKI
分类号 H01L21/304;B24B37/005;B24B37/04;B24B49/10;H01L21/306;H01L21/461 主分类号 H01L21/304
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