| 摘要 |
An embodiment relates to a light emitting device package for reducing manufacturing costs. The light emitting device package includes a substrate, a dam which is arranged on the substrate and has a first opening for exposing the upper surface of the substrate, light emitting chips which are arranged on the upper surface of the substrate exposed by the first opening, a molding part which is arranged in the first opening of the dam to seal the light emitting chips, a holder which is arranged on the substrate and has a second opening for exposing the molding part, and driving chips which are arranged on the lower surface of the holder and drive the light emitting chips with an alternating current. |
