| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
A semiconductor device includes a substrate having a first part and a second part, the first and second parts being continuous with each other and at different height levels, a first semiconductor chip overlapping the first and second parts of the substrate, an electrical interconnection structure connecting the first part of the substrate and the first semiconductor chip, a distance between the first part of the substrate and the first semiconductor chip being shorter than a distance between the second part of the substrate and the first semiconductor chip, and at least one electronic component in a space between the second part of the substrate and the first semiconductor chip. |
| 申请公布号 |
US2016071831(A1) |
申请公布日期 |
2016.03.10 |
| 申请号 |
US201514595370 |
申请日期 |
2015.01.13 |
| 申请人 |
LEE Baik-Woo;LEE Seok-Hyun |
发明人 |
LEE Baik-Woo;LEE Seok-Hyun |
| 分类号 |
H01L25/18;H01L23/00;H01L25/065;H01L23/538;H01L25/16;H01L23/498;H01L23/31 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a substrate having a first part and a second part, the first and second parts being continuous with each other and at different height levels; a first semiconductor chip overlapping the first and second parts of the substrate; an electrical interconnection structure connecting the first part of the substrate and the first semiconductor chip, a distance between the first part of the substrate and the first semiconductor chip being shorter than a distance between the second part of the substrate and the first semiconductor chip; and at least one electronic component in a space between the second part of the substrate and the first semiconductor chip. |
| 地址 |
Gwangmyeong-si KR |
