| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes: a substrate having an insulating resin and a metal pattern provided on the insulating resin; a mounted component mounted on the metal pattern; and an epoxy resin encapsulating the metal pattern and the mounted component, wherein a slit is provided in the metal pattern around the mounted component, and the insulating resin exposed from the metal pattern and the epoxy resin are brought into intimate contact with each other in the slit. |
| 申请公布号 |
US2016071821(A1) |
申请公布日期 |
2016.03.10 |
| 申请号 |
US201514728167 |
申请日期 |
2015.06.02 |
| 申请人 |
Mitsubishi Electric Corporation |
发明人 |
MASUMOTO Hiroyuki;KAWATA Hiroshi;MATSUMOTO Manabu;OTSUBO Yoshitaka |
| 分类号 |
H01L25/065;H01L23/367;H01L23/29;H01L23/498;H01L23/31 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a substrate having an insulating resin and a metal pattern provided on the insulating resin; a mounted component mounted on the metal pattern; and an epoxy resin encapsulating the metal pattern and the mounted component, wherein a slit is provided in the metal pattern around the mounted component, and the insulating resin exposed from the metal pattern and the epoxy resin are brought into intimate contact with each other in the slit. |
| 地址 |
Tokyo JP |
