| 发明名称 |
PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A METHOD FOR FORMING A PREFORM STRUCTURE FOR A SEMICONDUCTOR CHIP ARRANGEMENT, AND A METHOD FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT |
| 摘要 |
A preform structure for soldering a semiconductor chip arrangement includes a carbon fiber composite sheet and a solder layer formed over the carbon fiber composite sheet. |
| 申请公布号 |
US2016071814(A1) |
申请公布日期 |
2016.03.10 |
| 申请号 |
US201414477962 |
申请日期 |
2014.09.05 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Kroener Friedrich |
| 分类号 |
H01L23/00;B23K35/32;B23K35/30;B23K1/00;B23K35/02 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A preform structure for soldering a semiconductor chip arrangement, the preform structure comprising:
a carbon fiber composite sheet; and a solder layer formed over the carbon fiber composite sheet. |
| 地址 |
Neubiberg DE |
