| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
A semiconductor package includes a package substrate including a ground pad; a a conductive spacer and a first semiconductor chip disposed on the package substrate; a second semiconductor chip on the conductive spacer and the first semiconductor chip; a molding unit that covers the package substrate, the first semiconductor chip, the second semiconductor chip, and a first portion of the conductive spacer, and exposes a second portion of the conductive spacer; and an electromagnetic interference (EMI) shield that covers the molding unit. |
| 申请公布号 |
US2016071810(A1) |
申请公布日期 |
2016.03.10 |
| 申请号 |
US201514723721 |
申请日期 |
2015.05.28 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Park Young-woo |
| 分类号 |
H01L23/58;H01L23/528;H01L25/065;H01L23/522 |
主分类号 |
H01L23/58 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a package substrate comprising a ground pad; a conductive spacer and a first semiconductor chip disposed on the package substrate; a second semiconductor chip on the conductive spacer and the first semiconductor chip; a molding unit that covers the package substrate, the first semiconductor chip, the second semiconductor chip, and a first portion of the conductive spacer, and exposes a second portion of the conductive spacer; and an electromagnetic interference (EMI) shield that covers the molding unit. |
| 地址 |
Suwon-si KR |
