| 摘要 |
A polygonal packaging structure for packaging a sheet-like carrier, comprising at least a bottom buffer base (230) and a top buffer cover (290); the buffer base (230) is provided with a plurality of receiving grooves (121) thereon arranged radiating out in all directions; and the top buffer cover (290) is provided with fixation grooves (141) thereon corresponding to the receiving grooves (121). The polygonal packaging structure has a low packaging cost, a high compressive strength and a good impact resistance performance, receives more liquid crystal module panels, and is safe to package, and reliable and convenient to operate. |
