发明名称 APPARATUS AND METHOD FOR TREATING SUBSTRATE
摘要 The present invention relates to an apparatus for treating a substrate. According to one embodiment of the present invention, an apparatus for treating a substrate performs a printing process in an inkjet scheme. The apparatus for treating a substrate can include: a support unit supporting a substrate; a head unit including one or more heads spraying a process liquid on the substrate supported by the support unit; a gantry coupled with the heads and movable on an upper side of the support unit; a process liquid supply unit storing the process liquid supplied to the heads; and a controller controlling the apparatus for treating a substrate. The controller can include a head controller controlling the heads individually, and a printing controller communicating with the head controller and controlling an independent function with the heads.
申请公布号 KR20160027470(A) 申请公布日期 2016.03.10
申请号 KR20140114424 申请日期 2014.08.29
申请人 SEMES CO., LTD. 发明人 SEO, YUONG HO;KIM, DAE SUNG
分类号 H01L21/02;H01L21/683 主分类号 H01L21/02
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