PACKAGING METHOD AND ELECTRONIC SYSTEM PRODUCT

摘要

A packaging process and an electronic system product. The packaging process comprises: packaging an electronic system to form a packaged semi-finished product; and coating a surface of the packaged semi-finished product with a synthetic electromagnetic shielding material to form a shielding dielectric layer, wherein the synthetic electromagnetic shielding material has a first electric intermediate value and a first magnetic intermediate value. Thus, the problem about resonant frequency of the electronic system working in a cavity is avoided, and the electronic system can be well protected.