ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE

摘要

Provided are: an electronic-component-embedded substrate in which vibration is reduced even if distortion occurs in an electronic component within an embedding layer by the application of a voltage, and in which the generation of audible sounds caused by vibration is prevented or reduced; and a method for producing said electronic-component-embedded substrate. This electronic-component-embedded substrate 1 comprises: a substrate B; a first electronic component 10 mounted on a main surface of the substrate B; and an embedding layer R that is provided on the main surface of the substrate B, and in which the first electronic component 10 is embedded. The first electronic component 10 is a laminated ceramic capacitor provided with a ceramic laminate including: a laminated section; a first side section and a second side section that sandwich the laminated section; two end surfaces that oppose one another; and a side surface that connects the two end surfaces. The first side section is located between the laminated section and the main surface of the substrate B in the thickness direction which is the direction orthogonal to the main surface of the substrate B. The elastic modulus of the embedding layer R is smaller than the elastic modulus of the substrate B.