发明名称 METHOD FOR MANUFACTURING CONDUCTIVE PATTERN AND CONDUCTIVE PATTERN FORMED SUBSTRATE
摘要 Provided are a conductive pattern manufacturing method and a conductive pattern formed substrate, capable of easily achieving a narrow pitch. A metal nanowire layer 12 is formed on the entirety of a part of at least one of the main faces of a substrate 10, pulsed light is irradiated thereto through a mask 14 provided with a light transmission portion 14a formed in a predetermined pattern, and the metal nanowires in the metal nanowire layer 12 at the region having the above predetermined pattern were sintered, to thereby obtain conductivity at the predetermined patterned region. Accordingly, a substrate provided with a conductive pattern having any selected pattern can be produced by simple steps.
申请公布号 US2016073494(A1) 申请公布日期 2016.03.10
申请号 US201414786812 申请日期 2014.04.17
申请人 SHOWA DENKO K.K. 发明人 UCHIDA Hiroshi;SHINOZAKI Kenji;OKAZAKI Eri;OHATA Hideki;MIYAMURA Yasunao
分类号 H05K1/02;H05K3/12;G06F3/041;H05K1/09;H05K3/10 主分类号 H05K1/02
代理机构 代理人
主权项 1. A method for manufacturing a conductive pattern, the method comprising, a step for forming a metal nanowire layer containing metal nanowires, on the entirety or a part of at least one of the main faces of a substrate, and a step for irradiating light to the metal nanowire layer in a predetermined pattern to sinter the metal nanowires in the metal nanowire layer in a region of the predetermined pattern.
地址 Tokyo JP