| 摘要 |
Provided is a lead-free solder alloy for use on a terminal, said alloy having improved shedding when a terminal part is withdrawn from within molten solder. This lead-free solder alloy for use in terminal preplating comprises to 4 to 6% by mass of Cu, 0.1 to 0.2% by mass of Ni, 0.01 to 0.04% by mass of Ga, and 0.004 to 0.03% by mass of P, the total amount of Ga and P not exceeding 0.05% by mass, and the remainder comprising Sn. Upon melting after having been heated to the soldering temperature, said alloy has a tensile strength of 200 dyn/cm or less. |
