| 摘要 |
The present invention provides an apparatus and a method for treating a substrate. The apparatus for treating a substrate comprises a housing; a treating container located in the housing and providing a treating space of which the upper side is opened, therein; a substrate support unit to support the substrate in the treating space; a liquid supply unit to supply treating liquid on the substrate supported by the substrate support unit; an air current provision unit to provide a descending air current within the housing; and an air current guide plate which is located between the treating container and the substrate support unit, and of which an upper end is located at a position which is higher than the substrate supported by the substrate support unit, and a lower end is located at a position which is lower than the substrate supported by the substrate support unit. The treating container comprises an external cup for covering the substrate support unit and an upper guide plate extended toward the inside of the external cup from an inner wall of the external cup. An end of the upper guide plate is arranged to be separated from the air current guide plate. An external inflow space to which an air current, flowed to a periphery area of the treating space, of the descending air current is formed between the upper guide plate and the air current guide plate. An inner inflow space to which an air current, flowed to a center area of the treating space, of the descending air current is formed between the air current guide plate and the substrate supported by the substrate support unit. |
