SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM USING THE SAME

摘要

The objective of the present invention is to provide a semiconductor system capable of examining the interface properties of a semiconductor device equipped with a micro-bump pad. The semiconductor system comprises: a first semiconductor device including a first pad group; and a second semiconductor device including a second pad group electrically connected to the first pad group, a third pad group for inputting and outputting signals in and from a third semiconductor device, and a selective transmitting unit for connecting the third pad group to the first pad group or connecting an interface unit connected to the first pad group in response to a test mode enable signal.