| 摘要 |
The present invention relates to an apparatus for cleaning a wafer. The apparatus for cleaning a wafer in which a chemical mechanical polishing process is performed comprises: a wafer support for supporting the wafer while contacting a boundary of the wafer; a main cleaning nozzle spraying cleaning liquid to a first surface of the wafer, which faces upwards, to clean the first surface of the wafer in a non-contact scheme; and a brush for cleaning a second surface of the wafer, which faces downwards, in a contact scheme that a rotating brush contacts the second surface of the wafer. Therefore, the apparatus can prevent the generation of a damage such as a scratch on the wafer by a foreign substance in a process to clean the wafer in which the chemical mechanical polishing process is performed, and the like, and can realize uniform cleaning quality all the time, by removing the foreign substance stained on a process surface in the non-contact scheme, and excluding the usage of an apparatus for cleaning a brush of a contact type. In addition, the apparatus for cleaning a wafer is capable of obtaining the reliability of an operation by connecting and cleaning an opposite surface of the wafer with the brush in a short time, and by stably maintaining the position of the wafer not to deviate from a determined position even if a spraying pressure of the cleaning liquid is applied to the process surface of the wafer. |
