Multi-Layer Barrier Adhesive Film

摘要

A multi-layer barrier adhesive is used for the encapsulation of electronic devices, such as organic light-emitting diodes (OLEDs), photovoltaics, and thin-film transistors. The multi-layer adhesive comprises at least one barrier layer disposed adjacent at least one adhesive layer. In one embodiment the barrier layer is a fluoropolymer. The fluoropolymer is preferably a homopolymer of tetrafluoroethylene (PTFE) or chlorotrifluoroethylene (PCTFE), or their copolymers.

主权项

1. A multi-layer barrier adhesive film comprising an adhesive composition layer disposed over a barrier layer wherein the adhesive composition comprises an adhesive resin is selected from the group of resins consisting of polyisobutylene; acrylated or methacrylated polyisobutylene; acrylated or methacrylated polybutadiene; polyurethane; hydrogenated polybutadiene; epoxidized-polyisobutylene; polyisobutylene-oxetane; epoxy; bismaleimide; epoxidized polybutadiene; oxetane; acrylic polymer resins; block copolymers; and combinations of any of these resins.