FILM ADHESIVE, SEMICONDUCTOR PACKAGE USING FILM ADHESIVE AND METHOD FOR MANUFACTURING SAME

摘要

The purpose of the present invention is to provide: a film adhesive which is able to be reduced in the occurrence of voids even if cured in a short time at a high temperature during multistage lamination of a semiconductor chip; a semiconductor package which uses this film adhesive; and a method for manufacturing the semiconductor package. This film adhesive contains an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C) and a silica filler (D), and is characterized in that: the content of the silica filler (D) is 30-70% by mass relative to the total content of the epoxy resin (A), the epoxy resin curing agent (B), the phenoxy resin (C) and the silica filler (D); the film adhesive has a lowest melt viscosity within the range of 200-10,000 Pa·s in a temperature range from 120°C (exclusive) to 180°C (inclusive) if heated from room temperature at a heating rate of 5°C/minute; and the gelation time at 180°C by a hot plate method according to JIS K6911 is 1-200 seconds.