发明名称 MULTILAYER WIRING BOARD AND RESISTANCE ADJUSTMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can easily adjust a resistance value of a circuit part.SOLUTION: A multilayer wiring board 1 comprises a plurality of wiring patterns 21-24 which are connected in parallel with each other by a removable inter-layer connection part 3, and which are connected to inter-circuit connection parts J1, J2. By properly removing the inter-layer connection part 3 to isolate the wiring patterns 21-24 from the inter-circuit connection parts J1, J2, a combined resistance value of a wiring part 2 can be easily adjusted. Accordingly, even after manufacturing of the multilayer wiring board 1, a resistance value of the wiring part 2 can be adjusted.SELECTED DRAWING: Figure 3
申请公布号 JP2016033964(A) 申请公布日期 2016.03.10
申请号 JP20140156520 申请日期 2014.07.31
申请人 RICOH CO LTD 发明人 MIYAMA TOSHIYUKI
分类号 H05K3/46 主分类号 H05K3/46
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