MANUFACTURING METHOD OF MULTILAYER FLEXIBLE CIRCUIT STRUCTURE

摘要

A manufacturing method of multilayer flexible circuit structure including the following steps is provided. Two first flexible substrates are correspondingly bonded on two sides of a release film, and two conductive materials are correspondingly formed on the two first flexible substrates. The two conductive materials are patterned to form two first inner-layer circuits. Two outer build-up structures are bonded on the two corresponding first flexible substrates. The release film is removed, so as to separate the two first flexible substrates. An outer-layer circuit is formed on each of the first flexible substrates and the corresponding outer build-up structure, wherein the outer-layer circuit is connected to the corresponding first inner-layer circuit, and each of the first flexible substrates, the corresponding first inner-layer circuit, the outer build-up structure and the outer-layer circuit correspondingly form a multilayer flexible circuit structure. Another manufacturing method of multilayer flexible circuit structure is also provided.

主权项

1. A manufacturing method of multilayer flexible circuit structure, comprising:
correspondingly bonding two first flexible substrates on two sides of a release film, and correspondingly forming two conductive materials on the two first flexible substrates, so as to form a double-side flexible laminated structure, wherein each of the first flexible substrates is disposed between the corresponding conductive material and the release film; patterning the two conductive materials to form two first inner-layer circuits; bonding two outer build-up structures on the two corresponding first flexible substrates, wherein each of the outer build-up structures comprises a bonding layer and a second flexible substrate, and the bonding layer is disposed between the second flexible substrate and the corresponding first inner-layer circuit; removing the release film to separate the two first flexible substrates; and forming an outer-layer circuit on each of the first flexible substrates and the corresponding outer build-up structure, wherein the outer-layer circuit is connected to the corresponding first inner-layer circuit, and each of the first flexible substrates, the corresponding first inner-layer circuit, the outer build-up structure and the outer-layer circuit correspondingly form a multilayer flexible circuit structure.