发明名称 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 According to one embodiment, a semiconductor memory device includes a stacked body including a plurality of electrode layers separately stacked each other; a plurality of columnar sections provided in the stacked body and extending in a stacking direction of the stacked body; and a first insulating section separating the stacked body. The respective columnar sections include a semiconductor body extending in the stacking direction; and a charge storage film provided between the semiconductor body and the plurality of electrode layers. The first insulating section includes a first air gap.
申请公布号 US2016071926(A1) 申请公布日期 2016.03.10
申请号 US201514641051 申请日期 2015.03.06
申请人 Kabushiki Kaisha Toshiba 发明人 KITAZAKI Soichirou;Sato Mitsuru;Ishiduki Megumi
分类号 H01L29/06;H01L29/51;H01L21/3213;H01L29/423;H01L27/115;H01L21/28;H01L29/792;H01L29/66;H01L29/788;H01L21/02 主分类号 H01L29/06
代理机构 代理人
主权项 1. A semiconductor memory device comprising: a stacked body including a plurality of electrode layers separately stacked each other; a plurality of columnar sections provided in the stacked body and extending in a stacking direction of the stacked body; and a first insulating section separating the stacked body, the respective columnar sections including: a semiconductor body extending in the stacking direction; anda charge storage film provided between the semiconductor body and the plurality of electrode layers, and the first insulating section including a first air gap.
地址 Minato-ku JP