发明名称 |
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
According to one embodiment, a semiconductor memory device includes a stacked body including a plurality of electrode layers and a plurality of inter-layer insulating layers each provided between the plurality of electrode layers; and a columnar portion penetrating the stacked body and extending in a stacking direction of the stacked body. The columnar portion includes a channel body extending in the stacking direction; and a charge storage film provided between the channel body and each of the electrode layers. Each of the electrode layers includes an edge portion provided closer on a central axis side of the columnar portion than the inter-layer insulating layers. The charge storage film covers the edge portion of each of the electrode layers and separated from each other in the stacking direction. |
申请公布号 |
US2016071871(A1) |
申请公布日期 |
2016.03.10 |
申请号 |
US201514633405 |
申请日期 |
2015.02.27 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
KAMIGAICHI Takeshi |
分类号 |
H01L27/115;H01L21/02;H01L21/28;H01L29/45;H01L29/49 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor memory device comprising:
a stacked body including a plurality of electrode layers separately stacked each other; a semiconductor body having an end portion provided between the plurality of electrode layers, the semiconductor body provided in the stacked body and extending in a stacking direction of the stacked body; and a charge storage film provided between the semiconductor body and the plurality of electrode layers and separated via the end portion of the semiconductor body. |
地址 |
Minato-ku JP |