发明名称 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 According to one embodiment, a semiconductor memory device includes a stacked body including a plurality of electrode layers and a plurality of inter-layer insulating layers each provided between the plurality of electrode layers; and a columnar portion penetrating the stacked body and extending in a stacking direction of the stacked body. The columnar portion includes a channel body extending in the stacking direction; and a charge storage film provided between the channel body and each of the electrode layers. Each of the electrode layers includes an edge portion provided closer on a central axis side of the columnar portion than the inter-layer insulating layers. The charge storage film covers the edge portion of each of the electrode layers and separated from each other in the stacking direction.
申请公布号 US2016071871(A1) 申请公布日期 2016.03.10
申请号 US201514633405 申请日期 2015.02.27
申请人 Kabushiki Kaisha Toshiba 发明人 KAMIGAICHI Takeshi
分类号 H01L27/115;H01L21/02;H01L21/28;H01L29/45;H01L29/49 主分类号 H01L27/115
代理机构 代理人
主权项 1. A semiconductor memory device comprising: a stacked body including a plurality of electrode layers separately stacked each other; a semiconductor body having an end portion provided between the plurality of electrode layers, the semiconductor body provided in the stacked body and extending in a stacking direction of the stacked body; and a charge storage film provided between the semiconductor body and the plurality of electrode layers and separated via the end portion of the semiconductor body.
地址 Minato-ku JP