发明名称 |
RELEASE LAYER FOR SUBSEQUENT MANUFACTURE OF FLEXIBLE SUBSTRATES IN MICROELECTRONIC APPLICATIONS |
摘要 |
Compositions and methods are described for a release layer that is affixed directly onto a carrier or with the use of an interfacial adhesive layer to fabricate a flexible work product, and upon completion, the release layer is removed by an external applied force of a given value that overcomes the adhesive force without harm to the work product. The release layer serves as a permanent support for the manufacture of flexible electronic devices and upon completion offers a simple means to achieve a wide range of thin and ergonomically pleasing options for the consumer. The invention provides benefits of flexibility in choosing a host of materials to meet the needs of a specific manufacturing objective and rapidly moving towards the next step in the manufacture of semiconductors and flat panel displays. |
申请公布号 |
US2016071756(A1) |
申请公布日期 |
2016.03.10 |
申请号 |
US201414787789 |
申请日期 |
2014.04.29 |
申请人 |
MOORE John |
发明人 |
Moore John Cleaon;Pettit Jared;Law Alman |
分类号 |
H01L21/683 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
1. A release layer comprising a binder material that is affixed to a carrier substrate, and subsequently, with the aid of an external force, is removed without harm and without the need for a subsequent cleaning process wherein the release layer serves as a permanent substrate onto which is fabricated a flexible work product. |
地址 |
Camarillo CA US |