| 发明名称 |
PROCESSING APPARATUS |
| 摘要 |
A processing apparatus includes a processing chamber, a rotatable mounting table, a cooling mechanism and a driving mechanism. A sputtering target is provided in the processing chamber. The rotatable mounting table is provided in the processing chamber and configured to mount thereon an object to be processed. The cooling mechanism is configured to cool the mounting table. The driving mechanism is configured to change a relative position of the mounting table with respect to the cooling mechanism. The driving mechanism changes a conductivity of heat from the mounting table to the cooling mechanism at least by switching a first state in which the mounting table and the cooling mechanism are separated from each other and a second state in which the mounting table and the cooling mechanism become close to each other. |
| 申请公布号 |
US2016071707(A1) |
申请公布日期 |
2016.03.10 |
| 申请号 |
US201514842821 |
申请日期 |
2015.09.01 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
FURUKAWA Shinji;TOSHIMA Hiroyuki;KITADA Tooru;NAKAMURA Kanto;ONO Kazunaga |
| 分类号 |
H01J37/34;H01J37/32 |
主分类号 |
H01J37/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A processing apparatus comprising:
a processing chamber where a sputtering target is provided; a rotatable mounting table, provided in the processing chamber and configured to mount thereon an object to be processed; a cooling mechanism configured to cool the mounting table; and a driving mechanism configured to change a relative position of the mounting table with respect to the cooling mechanism, wherein the driving mechanism changes a conductivity of heat from the mounting table to the cooling mechanism at least by switching a first state in which the mounting table and the cooling mechanism are separated from each other and a second state in which the mounting table and the cooling mechanism become close to each other. |
| 地址 |
Tokyo JP |
