SEMICONDUCTOR TEST SYSTEM AND METHOD

摘要

A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

主权项

1. An integrated circuit comprising:
(a) input pads; (b) output pads; (c) first core circuitry having an input coupled to an input pad and having an output; (d) second core circuitry having an input coupled to the output of the first core circuitry and having an output; (e) third core circuitry having an input coupled to the output of the second core circuitry and having an output; (f) test connection circuitry having an input coupled with the input pad, having an output coupled with the input of the second core circuitry, and having an output coupled with the input of the third core circuitry; and (g) output circuitry including:
(i) a tri-state buffer having a core input, a data output coupled to an output pad, and a tristate enable input;(ii) comparator circuitry having a core input coupled to the core input of the tri-state buffer, a response input coupled to the output pad, and an enable input lead coupled to the tristate enable input of the tri-state buffer; and(iii) multiplex circuitry having a first input coupled to the output of the first core circuitry, a second input coupled to the output of the second core circuitry, a third input coupled to the output of the third core circuitry, a core select input, and a selected core output coupled to the core input of the tri-state buffer circuitry.