CIRCUIT STRUCTURE, AND METHOD FOR MANUFACTURING CIRCUIT STRUCTURE

摘要

A circuit structure (10) provided with: a circuit substrate (15); a heat dissipation member (23) overlapping the circuit substrate (15) and dissipating the heat from the circuit substrate (15); a pressure-sensitive adhesive sheet (20) containing a pressure-sensitive adhesive, the pressure-sensitive adhesive sheet (20) being arranged in a prescribed region between the circuit substrate (15) and the heat dissipation member (23); and an adhesive layer (22) arranged in a region between the circuit substrate (15) and the heat dissipation member (23) other than the prescribed region, the adhesive layer (22) containing an adhesive having a lower adhesive force than that of the aforementioned pressure-sensitive adhesive when the circuit substrate and the heat dissipation member are affixed to each other.