THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition which has excellent heat resistance, low thermal expandability, copper foil adhesiveness and solder heat resistance; and a prepreg, a laminate and a printed wiring board using the same.SOLUTION: There is provided a thermosetting resin composition used for a prepreg or the like which comprises: an amino-modified siloxane compound (A) having at least one primary amino group in the molecular structure thereof which is obtained by reacting a siloxane compound (i) having at least one carboxyl group in the molecular structure thereof and an amine compound (ii) having at least two primary amino groups in the molecular structure thereof; and a maleimide compound (B) having at least two N-substituted maleimide groups in the molecular structure thereof; or a modified imide resin (C) obtained by reacting an amino-modified siloxane compound (A) having at least one primary amino group in the molecular structure thereof and a maleimide compound (B) having at least two N-substituted maleimide groups in the molecular structure thereof.SELECTED DRAWING: None