| 发明名称 |
Packages and Methods of Forming Packages |
| 摘要 |
Various packages and methods of forming packages are discussed. According to an embodiment, a package includes a processor die at least laterally encapsulated by an encapsulant, a memory die at least laterally encapsulated by the encapsulant, and a redistribution structure on the encapsulant. The processor die is communicatively coupled to the memory die through the redistribution structure. According to further embodiments, the memory die can include memory that is a cache of the processor die, and the memory die can comprise dynamic random access memory (DRAM). |
| 申请公布号 |
US2016071829(A1) |
申请公布日期 |
2016.03.10 |
| 申请号 |
US201414554949 |
申请日期 |
2014.11.26 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Yeh Der-Chyang;Su An-Jhih |
| 分类号 |
H01L25/16;H01L21/56;H01L23/00;H01L25/00 |
主分类号 |
H01L25/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a processor die at least laterally encapsulated by an encapsulant; a memory die at least laterally encapsulated by the encapsulant; and a redistribution structure on the encapsulant, the processor die being communicatively coupled to the memory die through the redistribution structure. |
| 地址 |
Hsin-Chu TW |
