发明名称 LAMINATED BODY FOR MANUFACTURING PRINTED WIRING BOARD, METHOD FOR MANUFACTURING LAMINATED BODY FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 Provided is a laminated body for manufacturing a printed wiring board, said laminated body having one surface side of a peelable metal layer exposed such that wiring can be formed on the one surface, and being capable of, without requiring complicated later processing, effectively preventing peeling of the metal layer in an alignment hole, and infiltration of a chemical liquid into a peeling layer interface, while having a highly convenient configuration that is provided with a peelable metal foil having the alignment hole previously formed therein. This laminated body is formed by being provided with: a resin layer formed by containing a resin; a peelable metal layer, which is provided at least on one surface of the resin layer, and which is provided with two metal foils that are laminated such that the metal foils can be peeled from each other by having a peeling layer therebetween; an alignment hole that is provided in the peelable metal layer; and a hole surface sealing section that seals at least the surface of the alignment hole by being continuously provided in the alignment hole from the resin layer, said hole surface sealing section being formed by containing a resin.
申请公布号 WO2016035122(A1) 申请公布日期 2016.03.10
申请号 WO2014JP72921 申请日期 2014.09.01
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 IIDA HIROTO
分类号 H05K1/02 主分类号 H05K1/02
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