| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame capable of increasing the number of terminal parts connected with the outside.SOLUTION: A lead frame 10 comprises: a die pad 11 where a semiconductor element is mounted; a plurality of long outer peripheral lead parts 12A and short outer peripheral lead parts 12B, which are provided around the die pad 11 and each of which includes a first terminal part 53; and a connection ring 14 which is arranged between the die pad 11 and the long outer peripheral lead parts 12A and the short outer peripheral lead parts 12B to surround the die pad 11. The lead frame 10 comprises a plurality of inside lead parts 26A-26D which include long inside lead parts 26A, 26C and short inside lead parts 26B, 26D. The long inside lead parts 26A, 26C and the short inside lead parts 26B, 26D are alternately arranged one by one along the connection ring 14.SELECTED DRAWING: Figure 1 |
