| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treated copper powder for conductive paste excellent in sintering delay property.SOLUTION: There is provided a surface treated copper powder for conductive paste containing one or more element selected from a group consisting of Al, Si, Ti, Zr, Ce and Sn with attaching to a surface of copper powder, where attached amount of at least one element selected from a group consisting of Al, Si, Ti, Zr, Ce and Sn to copper powder of 1 g, x (μg) and sintering initiation temperature, y (°C) satisfy following formulae, 50≤x≤1500 and y≥0.2x+530, a substrate to which a conductive paste containing surface treated copper powder is applied is a coated film containing ceramic particle or metal powder particle, average particle diameter of the ceramic particle, D50cer or average particle diameter of the metal powder particle D50 met and average particle diameter of the surface treated copper powder D50cu satisfy following formula:0.01≤D50cu/D50 met≤1.0 when the coated film contains the metal powder particle and following formula:0.01≤D50cu/D50cer≤1.0 when the coated film contains no metal powder particle.SELECTED DRAWING: None |
