TOP COUPLED PHOTONIC CHIP ALIGNMENT PACKAGE

摘要

The present invention provides an improved coupling and improved alignment of top-coupled photonic chips. The present invention includes a method to package and align top-coupling photonic chips using a holographic grating coupler and V-groove placement comprising the steps of: preparing the photonic chip with grating couplers, preparing the fibers by polishing the ends, preparing the cap chip by defining V-grooves to complement the photonic chip, attaching the fibers to the V-block cap chip, and top-cladding the cap chip to the photonic chip. The present invention also includes the apparatus resulting from the aforementioned method.

主权项

1. A method for bonding optical fibers to a photonic chip comprising the steps of:
preparing said photonic chip with at least one grating coupler; preparing at least one said optical fiber by polishing an end; preparing a cap chip by defining at least one V-groove; attaching said at least one optical fiber to said V-block cap chip; and top-cladding said V-block cap chip to said photonic chip.