METHOD FOR DETERMINING SET VALUE OF PRESSURE FOR INSPECTION IN WAFER INSPECTION APPARATUS

摘要

In a method for determining a set value of a pressure for inspection in a wafer inspection apparatus, a surrounding space sealable between a chuck top and a probe card by a vacuum mechanism is evacuated and a highest negative pressure in the surrounding space is measured as a reference pressure when the chuck top has floated by the evacuation. Then as a reference height position, a height position of the chuck top corresponding to the reference pressure is obtained. Further, a pressure in the surrounding space is decreased to a level lower than the reference pressure, the pressure in the surrounding space, when the chuck top reaches a target height position obtained by adding a preset overdrive amount for a press-contact state between the probe card and the wafer to the reference height position, is measured and the measured pressure is set as the set value of the pressure.

主权项

1. A method for determining a set value of a pressure for inspection in a wafer inspection apparatus including: a probe card having a plurality of contactors to be respectively brought into contact with a plurality of electrodes formed on a surface of a wafer as an inspection target; a movable chuck top configured to mount the wafer thereon to face the probe card; and a vacuum mechanism configured to control a pressure in a surrounding space sealable between the chuck top and the probe card to a predetermined set value of a negative pressure for inspection in order to generate or maintain a press-contact state between the probe card and the wafer by a predetermined pressing force, the method comprising the steps of:
(a) evacuating the surrounding space by the vacuum mechanism and measuring, as a reference pressure, a highest negative pressure in the surrounding space which is obtained when the chuck top floats; (b) obtaining, as a reference height position, a height position of the chuck top which corresponds to the reference pressure; and (c) decreasing a pressure in the surrounding space to a level lower than the reference pressure, measuring the pressure in the surrounding space when the chuck top reaches a target height position obtained by adding a preset overdrive amount for the press-contact state between the probe card and the wafer to the reference height position, and setting the measured pressure as the set value of the pressure for inspection.