POLISHING METHOD AND POLISHING DEVICE

摘要

The present invention relates to a polishing method and polishing device for performing chemical treatment of a substrate prior to polishing and between polishings for semiconductor wafers and other substrates. The polishing method for polishing a substrate by pressing the substrate to be polished on a polishing surface on a polishing table comprises a chemical washing treatment step for, when a plurality of stages of polishing treatment are performed on substrates using a plurality of polishing tables, performing washing treatment of the substrates using a chemical liquid between the plurality of stages of polishing treatment.