| 摘要 |
The present invention relates to a light emitting device and, especially, to a light emitting device where a bonding pad is soldered on a mounting substrate. The light emitting device has a bonding pad shape which can minimize a void occurrence phenomenon generated during a soldering process. The bonding pad is connected to a first electrode and a second electrode that are electrically connected to a first conductive semiconductor layer and a second conductive semiconductor layer by a connection electrode, respectively. Two or more line-shaped bonding pads are formed in a solder ball connectable area, and at least two among the line-shaped bonding pads face each other. A nonconductive area exists between the bonding pads that face each other. |
