INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

According to one embodiment, an integrated circuit device includes a substrate. The integrated circuit device also includes a stacked body provided on the substrate, insulating films and electrode films being alternately stacked in the stacked body. The integrated circuit device also includes a stopper member selectively provided in the electrode film in a bottom layer and a first stopper protection film provided on a side surface of the stopper member. The integrated circuit device also includes an insulating member provided immediately on the stopper member and configured to pierce through the stacked body in a stacking direction of the insulating films and the electrode films, a lower end of the insulating member disposed in the stopper member. The integrated circuit device also includes a semiconductor pillar provided in a side direction of the insulating member and configured to pierce through the stacked body in the stacking direction.

主权项

1. An integrated circuit device comprising:
a substrate; a stacked body provided on the substrate, insulating films and electrode films being alternately stacked in the stacked body; a stopper member selectively provided between the substrate and the stacked body; a first stopper protection film provided on a side surface of the stopper member; an insulating member provided immediately on the stopper member and configured to pierce through the stacked body in a stacking direction of the insulating films and the electrode films, a lower end of the insulating member disposed in the stopper member; and a semiconductor pillar provided in a side direction of the insulating member and configured to pierce through the stacked body in the stacking direction.