METHOD OF FORMING A THIN FILM THAT ELIMINATES AIR BUBBLES

摘要

A method, which forms an air-bubble-free thin film with a high-viscosity fluid resin, initially dispenses the fluid resin on an outer region of a semiconductor wafer while the semiconductor wafer is spinning, and then dispenses the fluid resin onto the center of the semiconductor wafer after the semiconductor wafer has stopped spinning.

主权项

1. A method of forming a thin film in a processing station, the processing station having a wafer chuck and a supply line, the supply line having a tube dispensing opening, the method comprising:
dispensing a fluid resin from the tube dispensing opening onto a semiconductor wafer while the semiconductor wafer is spinning, and changing a relative position between the wafer chuck and the tube dispensing opening so that the fluid resin is dispensed onto the semiconductor wafer in a circular pattern; and decelerating the semiconductor wafer from spinning to a stop after the circular pattern has been formed, and changing a relative position between the wafer chuck and the tube dispensing opening so that the fluid resin continues from the circular pattern to a center of the semiconductor wafer, and forms a puddle of resin over the center of the semiconductor wafer.