| 发明名称 |
METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR DEVICE |
| 摘要 |
A method of making a three-dimensional (3D) integrated circuit (IC) includes performing a series of simulations of operations of a first die of the 3DIC in response to a corresponding series of input vectors and at least one environment temperature. The method also includes adjusting, for at least one simulation in the series of simulations, the at least one environment temperature based on an operational temperature profile of a second die of the 3DIC. |
| 申请公布号 |
US2016070839(A1) |
申请公布日期 |
2016.03.10 |
| 申请号 |
US201514940218 |
申请日期 |
2015.11.13 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
CHANG Chi-Wen;LEE Hui Yu;LIU Ya Yun;KUAN Jui-Feng;CHENG Yi-Kan |
| 分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of making a three-dimensional (3D) integrated circuit (IC), the method comprising:
performing a series of simulations of operations of a first die of the 3DIC in response to a corresponding series of input vectors and at least one environment temperature; and adjusting, for at least one simulation in the series of simulations, the at least one environment temperature based on an operational temperature profile of a second die of the 3DIC. |
| 地址 |
Hsinchu TW |
