发明名称 |
ELECTRONIC UNDERLAY |
摘要 |
Provided is an electronic underlay in which, even when a hand is laid on a writing trace or an uneven portion on a paper, the writing trace is not detected. The electronic underlay is placed beneath a paper, which is written upon using a writing tool, and includes: an optical waveguide in a sheet form configured such that linear cores arranged in a lattice form are held between an under cladding layer and an over cladding layer; a light-emitting element connected to one end surface of the linear cores; and a light-receiving element connected to the other end surface of the linear cores. The over cladding layer is covered with a sheet material made of a resin, and the sheet material has an elasticity modulus within a range of 1 MPa to 200 GPa and a thickness of 5 μm to 200 μm. |
申请公布号 |
US2016070417(A1) |
申请公布日期 |
2016.03.10 |
申请号 |
US201414784100 |
申请日期 |
2014.05.26 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
Yoshioka Ryoma;Shimizu Yusuke |
分类号 |
G06F3/042;G06F3/041;G06F3/0354;G02B6/125 |
主分类号 |
G06F3/042 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electronic underlay comprising:
an optical waveguide in a sheet form including an under cladding layer in a sheet form, a plurality of linear cores arranged in a lattice form and formed on a surface of the under cladding layer, and an over cladding layer in a sheet form formed to cover the cores; a light-emitting element connected to one end surface of the cores; a light-receiving element connected to an other end surface of the cores; and a sheet material covering a surface of the over cladding layer, and having an elasticity modulus within a range of from 1 MPa to 200 GPa, and a thickness within a range of from 5 μm to 200 μm, wherein the electronic underlay is placed beneath a paper, which is written upon using a writing tool, wherein a surface of the sheet material serves as a contact surface for the paper, and wherein a pressed position is specified based on a change in the amount of light propagation in the cores when the surface of the over cladding layer is pressed at any portion, via the sheet material. |
地址 |
Ibaraki-shi, Osaka JP |