发明名称 ELECTRONIC UNDERLAY
摘要 Provided is an electronic underlay in which, even when a hand is laid on a writing trace or an uneven portion on a paper, the writing trace is not detected. The electronic underlay is placed beneath a paper, which is written upon using a writing tool, and includes: an optical waveguide in a sheet form configured such that linear cores arranged in a lattice form are held between an under cladding layer and an over cladding layer; a light-emitting element connected to one end surface of the linear cores; and a light-receiving element connected to the other end surface of the linear cores. The over cladding layer is covered with a sheet material made of a resin, and the sheet material has an elasticity modulus within a range of 1 MPa to 200 GPa and a thickness of 5 μm to 200 μm.
申请公布号 US2016070417(A1) 申请公布日期 2016.03.10
申请号 US201414784100 申请日期 2014.05.26
申请人 NITTO DENKO CORPORATION 发明人 Yoshioka Ryoma;Shimizu Yusuke
分类号 G06F3/042;G06F3/041;G06F3/0354;G02B6/125 主分类号 G06F3/042
代理机构 代理人
主权项 1. An electronic underlay comprising: an optical waveguide in a sheet form including an under cladding layer in a sheet form, a plurality of linear cores arranged in a lattice form and formed on a surface of the under cladding layer, and an over cladding layer in a sheet form formed to cover the cores; a light-emitting element connected to one end surface of the cores; a light-receiving element connected to an other end surface of the cores; and a sheet material covering a surface of the over cladding layer, and having an elasticity modulus within a range of from 1 MPa to 200 GPa, and a thickness within a range of from 5 μm to 200 μm, wherein the electronic underlay is placed beneath a paper, which is written upon using a writing tool, wherein a surface of the sheet material serves as a contact surface for the paper, and wherein a pressed position is specified based on a change in the amount of light propagation in the cores when the surface of the over cladding layer is pressed at any portion, via the sheet material.
地址 Ibaraki-shi, Osaka JP