发明名称 |
METHOD FOR MANUFACTURING METAL SUBSTRATE HAVING ELECTRONIC DIVICE FORMED THEREON |
摘要 |
Disclosed is a method for manufacturing a metal substrate formed with an electronic device. The method for manufacturing a metal substrate formed with an electronic device according to an aspect of the present invention includes the steps of: preparing a metal substrate; coating frit on at least a part of one surface of the metal substrate; locating a glass substrate on the coated frit, and bonding the metal substrate to the glass substrate by irradiating a laser beam to the frit; forming the electronic device on the other surface of the metal substrate; and separating the metal substrate, where the electronic device is formed, from the glass substrate. According to the method, the metal substrate can be easily separated from the glass substrate. |
申请公布号 |
KR20160027308(A) |
申请公布日期 |
2016.03.10 |
申请号 |
KR20140113138 |
申请日期 |
2014.08.28 |
申请人 |
POSCO |
发明人 |
KIM, KYOUNG BO;LEE, JAE RYUNG;KIM, JONG SANG;PARK, YOUNG JUN;KIM, MOO JIN |
分类号 |
H01L27/32;H01L51/56 |
主分类号 |
H01L27/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|