| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure capable of reducing noise while obtaining high degree of freedom in circuit design.SOLUTION: A mounting structure 1 is structured by mounting an electronic component 10 on a circuit substrate 50. Lands 54a and 54b are mounted on a substrate main body 52 and connected to outer electrodes 12a and 12b by solders 60a and 60b, respectively. The height H1 from the land electrodes 54a and 54b to the top of the solders 60a and 60b is 1.27 times or less the height H2 from the land electrodes 54a and 54b to a portion where a capacitor conductor 32d located nearest to the circuit board 50 is exposed from an end surface S3. A dummy conductor is provided between the mounting surface and the capacitor conductor nearest to the mounting surface.SELECTED DRAWING: Figure 1 |
