| 发明名称 |
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONS |
| 摘要 |
Devices and method related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer |
| 申请公布号 |
US2016073490(A1) |
申请公布日期 |
2016.03.10 |
| 申请号 |
US201514839975 |
申请日期 |
2015.08.29 |
| 申请人 |
SKYWORKS SOLUTIONS, INC. |
发明人 |
BRANCHEVSKY Shaul;CHEN Howard E.;LOBIANCO Anthony James |
| 分类号 |
H05K1/02;H05K1/03;H05K3/46;H05K3/00;H05K3/12;H05K3/22;H05K1/18;H01L23/31;H01L23/15;H01L23/06;H01L23/00;H05K1/11;H05K3/42 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A ceramic assembly comprising a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer. |
| 地址 |
Woburn MA US |
