DEVICES AND METHODS FOR STARTING STRIP MATERIAL IN A SUBSTRATE PROCESSING MACHINE

摘要

Systems and methods are disclosed for starting a strip material in a substrate processing machine wherein the machine is not stopped and/or operators do not have to reach into the running machine to start the strip material. Exemplary systems include a strip material guide apparatus including at least one guide arm and at least one gas stream generator configured to direct strip material from the guide arm into a substrate processing machine to join the strip material with one or more running substrates. The gas stream generator is operable to cause a leading end of a strip material dispensed from the guide arm to be conveyed via a gas stream toward the running substrates, such that the leading end of the strip material becomes engaged by the substrate processing machine and the strip material joins with the running substrate.

主权项

1. A system for starting strip material in a substrate processing machine that includes at least a first running substrate and a nip point where the first running substrate and the strip material are join together, the system comprising:
a strip material guide apparatus configured to direct strip material from a strip material source into the nip point to join the strip material with the first running substrate, the strip material guide apparatus including at least one guide arm operable to guide strip material being dispensed from the strip material source into a desired position relative to the first running substrate; and a gas stream generator coupled to the guide apparatus and positioned adjacent to a strip material outlet of the guide arm, the gas stream generator operable to generate a stream of gas flowing in a general direction of the first running substrate or the nip point; wherein the gas stream generator is operable to cause a leading end of a strip material to be conveyed via a gas stream toward the first running substrate or the nip point, such that the leading end of the strip material becomes engaged by the substrate processing machine at the nip point and joins with the first running substrates.