| 摘要 |
A conductive film laminate is provided with an insulating support having the shape of a flat plate, and a conductive film joined to the surface of the support by an adhesive. The conductive film has an insulated substrate having flexibility and a conductive layer arranged on the surface of the insulated substrate, the insulated substrate having at least one opening, created by cutting out a portion at which molding strain concentrates when a conductor is formed, and the opening being closed up by the support. |
