| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrode structure for an electronic component, which prevents solder erosion when a Cu plating layer and a solder layer or an Sn plating layer are formed in an electrode part, and has improved adhesion. <P>SOLUTION: A pair of electrode parts 50 spaced apart from each other are provided on a rear surface 10b of a resistor 1, and an insulating layer 2A is provided between the pair of electrode parts 50. Each of the electrode parts 50 is constituted of an electrode layer 3 and a plating electrode layer laminated on the electrode layer 3. The plating electrode layer comprises a copper plating layer 31, a tin plating layer 32, a nickel plating layer 33, and a plating layer 34 containing tin. <P>COPYRIGHT: (C)2013,JPO&INPIT |
