| 摘要 |
Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250°C. In order to make the structure of an Sn-Sb-Ag-Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass%, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn. |
