发明名称 Improvements relating to the production of wafers of semi-conductor material
摘要 852,003. Semi-conductor devices. SIEMENS EDISON SWAN Ltd. May 22, 1959 [June 10, 1958], No. 18536/58. Class 37 A slice of monocrystalline germanium or other semi-conductor is separated into sections by scribing lines on the slice and then etching with an etchant which preferentially attacks the strained regions of the semi-conductor. The etchant may consist of equal proportions of hydrogen peroxide and potassium hydroxide, and used at 70‹ to 80‹C. The scribing may be performed by means of a diamond probe, and a plurality of slices may be processed simultaneously. Fig. 2 shows a pattern of scribed lines on a crystal, and Fig. 3 the position after etching has taken place.
申请公布号 GB852003(A) 申请公布日期 1960.10.19
申请号 GB19580018536 申请日期 1958.06.10
申请人 SIEMENS EDISON SWAN LIMITED 发明人 FREESTONE ROLAND;WEIR MARY TERESA
分类号 B28D5/00;C23F1/02;C30B33/00;H01L21/00;H01L21/301;H01L21/304 主分类号 B28D5/00
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